SE-88E

SE-88E belongs to an Additive Series that capable to bring about high roughness and forms numerous micro cavities with mountain-like structure  on copper surface, this enhances the adhesion between Dry Film and copper and minimizes the “Open” error rate due to MicroEtching. It is especially useful in manufacturing small traces of products that contain high thickness copper plating layer or high frequency plating products.

Application: Use in Pretreatment step prior to Dry film lamination step for products that contain copper plating outer layer or high frequency plating products, especially for products that contains traces with width and distance below 60µm.

Bring about high roughness (Ra: 0.25 ~ 0.5µm)

The high roughness can be maintained from the pretreatment of Dryfilm lamination step to the pretreatment of Soldermask step, while still ensuring the Solder mask’s adhesion to the copper surface.