SES is an alkaline etching process, specifically used for products requiring thin copper pathways but high copper thickness. It includes several sub-processes:
D/F Stripping: Removing the unhardened D/F layer on the product surface after pattern and tin plating to expose the copper layer beneath the D/F.
Etching: Using an alkaline etching system to remove completely the exposed copper layer. The removing speed is high, and the copper layer to be removed has a low thickness .
Tin Stripping: Using chemical additives to remove the protective tin layer to expose the copper pathways.
