ENIG, an acronym for Electroless Nickel – Immersion Gold, is a process commonly used in the final stage of manufacturing electronic circuit boards, before components are embedded.
Essentially, the ENIG process consists of two steps: Electroless nickel plating and gold immersion. Immersion gold is an ion exchange reaction where a nickel-plated component is immersed in a solution containing Au+ ions to form a gold coating on the nickel surface.
