Ag 300A

Ag300A is chemical use in Silver immersion plating process.

Pure Silver is an ideal material for surface finishing because it possesses properties such as softness, good ductility, thermal conductivity, electrical conductivity; and is barely reactive with water or oxygen.

These properties make silver immersion another popular surface finish in PCB manufacturing. Chemically, it creates a thin silver layer with thickness in range of 0.1~0.5µm on the copper surface to protect the copper from oxidation and improve solderability.

The silver immersion process is based on the Galvanic effect, driven by the difference in electromotive force and redox potential between copper and silver, silver ions receive electrons from copper metal while copper dissolves and silver precipitates. Specifically, a rearrangement reaction occurs between silver ions and copper atoms in solution.

Silver immersion is an environmentally friendly surface finishing and fully compliant with RoHS.

It has excellent surface flatness, suitable for high-density circuits and narrow copper pathways. Due to the surface effect, its signal attenuation in high-frequency PCB is also very low.